Ansys’ latest collaboration with AMD resulted in a solution that, according to Ansys’ tests, significantly speeds up simulation of large structural mechanical models — between three and six times ...

Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging.

Ansys Totem solution for transistor-level and mixed-signal design is also certified, delivering customers the same verification reliability and accuracy when running projects in a distributed ...