LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...
Weighing in at 10 metric tons, the HB 10000 delivers 50 percent more impact energy than the previously largest hydraulic breaker attachment from Atlas Copco, the HB 7000. Accepting hydraulic flow of ...
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