Synopsys continues to work with TSMC to expand multiphysics analysis flows for larger designs with hierarchical analysis methodology. The multiphysics flow includes Ansys RedHawk-SC, Ansys RedHawk-SC ...
The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...
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